STYCCOBOND F58PLUS
STYCCOBOND F58PLUS
STYCCOBOND F58PLUS is a fast-drying, solvent free adhesive that can be used as a wet lay, semi-wet or pressure sensitive adhesive for securing PVC vinyl sheet and tile floorcoverings.
When used as a wet lay adhesive, STYCCOBOND F58PLUS is suitable for rubber sheet and tile floorcoverings up to 4mm thick.
It is designed to give a high bond strength and strong initial tack. It is protected against bio- degradation and is suitable for use over normal underfloor heating installations.
See the F. Ball Recommended Adhesives Guide for details of specific floorcoverings.
STYCCOBOND F58PLUS can be applied to STOPGAP smoothing underlayments, structurally sound, smooth, dry subfloors of concrete and sand/cement screed, plywood, flooring grade chipboard and hardboard.
STYCCOBOND F58PLUS can be applied directly to epoxy resin STOPGAP waterproof surface membranes and other non-absorbent subfloors when used as a pressure sensitive adhesive and where the surface finish is smooth enough to permit the installation of PVC floorcoverings.
Sound flooring grade asphalt must be skimmed with a minimum of 3mm of the appropriate STOPGAP smoothing underlayment.
For details on other subfloors, contact our Technical Service Department.
STYCCOBOND F58PLUS has been tested to the standards of the International Maritime Organisation and approved for use in marine floor installations.
SURFACE PREPARATION
Proper subfloor preparation is essential for the correct installation of any floorcovering. Subfloors must be structurally sound, smooth, dry (<75% RH) and free from laitance and any contaminants which will affect adhesion. Use STYCCOCLEAN C140 for removing grease, oil, polish, soap etc. from non-absorbent substrates.
Concrete and sand/cement screeds must be fully cured and any laitance or surface treatments must be removed.The temperature of the floor must be maintained above 10°C throughout the application and drying of the adhesive. Underfloor heating must be off for at least 48 hours before, during and after application.
For detailed information, request the F. Ball Subfloor Preparation Guide.